Fremont, California., February 19, 2025 /PRNEWSWIRE/ -LAM Research Corp. (NASDAQ: LRCX) has announced Altus® Halo, the world’s first atomic layer deposition (ALD) tool that leverages the capabilities of molybdenum metal in the production of cutting-edge semiconductors. Leveraging a variety of patented innovations, Altus Halo offers the low resistance of advanced semiconductor devices, the outstanding filling and precision deposition of reactive molybdenum metallization. Currently qualifying and ramping with all major chip manufacturers, Altus Halo represents a turning point in the new era of semiconductor metallization, and the advanced features of tomorrow’s AI, cloud computing, and next-generation smart devices. It paves the way for future scaling of memory and logic chips.
Altus Halo is the latest addition to Lam’s Altus product family and is part of a differentiated product portfolio that allows Chipmaker to overcome some of the industry’s most challenging scaling challenges. I am participating in Akara®. Akara® is the most advanced conductor Etcher, announced separately today by LAM Research.
Altus Halo is exploiting the possibilities of molybdenum
As the performance demands of next-generation applications increase, more sophisticated semiconductors and new manufacturing processes to create them will be needed. Metal atom-by-atom deposition is essential for the production of all cutting-edge chips today. Tungsten-based ALD, which LAM first pioneered, has been the primary metallization technique for contact and line deposition and ineffective filling for over 20 years. However, to scale future NAND, DRAM and logic devices, chip manufacturers will need to shift their metallization beyond what is currently possible with tungsten integration. With Altus Halo, Lamb is playing a leadership role in the transition from tungsten to molybdenum in the semiconductor industry.
“Based on Ram’s deep metallization expertise, Altus Halo has been the most important breakthrough in atomic layer deposition for over 20 years,” he said. Sesha VaradarajanSenior Vice President and General Manager of the Global Products Group at LAM Research. “It combines Ram’s quad station module architecture with new advances in ALD technology, providing engineering low-resistant molybdenum deposition for bulk manufacturing. Advanced Gate-All-Around logic.”
Molybdenum enables the low resistance metallization required for next-generation chips
When a semiconductor works, high-speed electrical signals will pass through connections such as 3D NAND Wordlines to send commands. Nanoscale features are etched and, if copper is not available, are traditionally filled with tungsten to create the required connection. The lower the metal resistivity, the faster the signal speed. Additionally, traditional tungsten-based wiring adds an additional barrier layer to prevent unnecessary electrical interactions. Because it is NAND, DRAM, and logical scale for more complex architectures, including 3D integration, electrical signals must go through more restrictive connections. This will slow down the chances and speeds of bottlenecks and, in some cases, more likely to have electric shorts.
Molybdenum is an ideal metal for these applications as it has a lower resistivity for nanoscale wires than tungsten and does not require adhesion or barrier layers. Through decades of metallization and advanced development expertise, as well as new innovations in deposition technology, LAM has made molybdenum ALD viable for mass production for the first time. In most cases, Altus Halo has more than 50% better resistance than traditional tungsten metallization.
Altus Halo is in production
Altus Halo offers the most accurate and advanced deposition of molybdenum in the semiconductor industry. The Altus Halo Tool Series is optimized for a variety of metallization needs, using bottom-up fills using chemical and thermal flexibility, and using plasma for temperature-sensitive applications. Can be adapted to bottom-up features or selectively deposited.
Early adoption has begun in Korea with a large number of 3D NAND manufacturers with FABS and a large number of 3D NAND manufacturers. Singapore Advanced logic fab continues development with DRAM customers.
“By integrating molybdenum metallization, Micron is the first to market with industry-leading I/O bandwidth and storage capacity in the latest generation of NAND products,” he said. Mark KielbauchVice President of NAND Development at Micron. “Ram’s Altus Halo Tool allows Micron to bring molybdenum into mass production.”
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About LAM research
Lam Research Corporation is a global supplier of innovative wafer manufacturing equipment and services to the semiconductor industry. LAM’s equipment and services allow customers to build smaller, more performant devices. In fact, almost every advanced chip is built with LAM technology today. We combine excellent systems engineering, technology leadership and a strong value-based culture with an unwavering commitment to our customers. LAM Research (NASDAQ: LRCX) is headquartered in a Fortune500® company Fremont, California.it is operated all over the world. For more information, please visit www.lamresearch.com.
Forward-looking notice
The statement made in this press release, which is not historical fact, is forward-looking statement and is subject to the safe port clauses prepared by the Private Securities Litigation Reform Act of 1995. Market trends and expectations. Customer recruitment and use of LAM products. Product performance including technical and cost benefits. Several factors that may affect these forward-looking statements include: The behavior of our customers and our competitors may be inconsistent with our expectations. Business, political, and/or regulatory conditions where the consumer electronics, semiconductor industry, and the overall economy may deteriorate or change. Trade regulations, export regulations, trade disputes, and other geopolitical tensions can hinder our ability to sell our products. Increased supply chain costs and other inflationary pressures are affecting them and could continue to affect profitability. Supply chain disruptions or manufacturing capacity constraints may limit our ability to manufacture and sell our products. and any natural and human-raised disasters, disease outbreaks, wars, terrorism, political or governmental uncertainty or instability, or other events beyond our control, will be the responsibility of our operations and our operations in affected areas. It could affect your income. Additionally, other risks and uncertainties mentioned in documents we filed with or filed with the Securities and Exchange Commission, including risk factors, particularly those mentioned in our annual report on Form 10-K for the fiscal year. June 30, 2024 Quarterly report on Form 10-Q for fiscal quarter has concluded December 29, 2024. These uncertainties and changes have a material impact on forward-looking statements and differ from expectations in a way that actual results are important. We have no obligation to update any information or statements made in this release.
Company Contact Information:
Allison L. Parker
Media related
(510) 572-9324
(Email protection)
Ram Ganesh
Investor relations
(510) 572-1615
(Email protection)
Source: Lam Research Corporation, (NASDAQ: LRCX)
Source Lam Research Corporation
