Recent industry reports reveal that Micron is preparing to start mass production of Nvidia’s 12-layer HBM3E memory, and is struggling to accommodate this advancement, making it a big deal for Samsung Electronics It could put pressure on you.
According to a report by Seoul Economic Daily and Business Korea, Micron is making significant advances with 12-layer HBM3E technology. Following the distribution of sample to customers in 2024, Micron’s CFO Mark Murphy has achieved 20% less power consumption at Wolfe’s research event, with 12-layer HBM3E products delivering 20% less power consumption, compared to their competitor’s 8-layer versions. It emphasized providing a lot of capacity. Murphy predicts that 12-layer products will dominate HBM production by the second half of 2025.
Industry sources say Micron is nearing completion of sample testing, marking a critical step towards mass production, particularly for its major customer, Nvidia. The company’s advances in the production of 12-layer HBM3E could pose a major challenge for Samsung, which has yet to secure Nvidia’s verification of 8- or 12-layer products.
Samsung has restricted mass production of 8-layer HBM3E, but continues to Trail SK Hynix and Micron, with production remaining constrained. The 12-layer version remains in development, and samples will be available to Nvidia for the end of February 2025. However, additional time is required to obtain final supply approval.
During the latest revenue call, Samsung announced that improvements to HBM3E products can select customers by the end of the first quarter of 2025, with supply increasing in the second quarter. Industry analysts are set to launch enhanced versions of both 8- and 12-layer HBM3E, with Samsung focusing on improving the HBM architecture for better yield and performance through modifications to equipment and materials in production. It suggests that you are trying to guess.
Going forward, Murphy unveiled Micron’s plans to ship HBM4s in 2026, strengthening competition in the HBM market. By 2025, Samsung is aiming to mass-produced HBM4 using advanced 1C DRAM technology and continues its efforts to improve DRAM performance and yield.
