ST. Paul, Min.,, February 3rd2025 / Prnewswire/ – 3m Participating in the US Consortium, which is a strategic partnership of 12 major semiconductor suppliers, is expanding commitment to the semiconductor industry. The Consortium is promoting research and development of high next -generation semiconductor high packaging and back -end processing technology fixed by new cutting -edge facilities in Silicon Valley.
“As the demand for AI and other high -performance computing technology increases, suppliers need to cooperate and provide comprehensive solutions for tough tough tasks in a shorter timeline.” Stephen Vander LouPresident of a 3M display and electronics product platform. “The US Consortium Companies represent the United States and Japan’s innovation leaders with various advanced packaging technology. 3m In order to deal with these issues, I am happy to be able to participate in the Consortium to bring more decades of material science, which spans more than 50 technology platforms. “
For more than 25 years 3m Semiconductor polishing, advanced packaging, and suppliers for materials and processing assistants for chip transportation applications. The team with the industry leader has been strengthening the 3M commitment of becoming an integrated solution provider in the semiconductor industry.
The Consortium was established in 2023 and led Japan-Resonac based, a global leader in the semiconductor and electronics industry.
“We are glad to welcome 3m To the US Consortium. ” Hidenori BESemiconductor material CTO, resonac. “The 3M expertise in material science, advanced packaging devices and process solutions to the innovation of process solutions cooperate to solve difficult technical and integrated issues for land customers. To do it, it will be an asset. US。 “
The new US-Joint Consortium R & D facilities will be announced later this year, along with public launch events.
See the advanced packaging technology of semiconductors 3m.com.
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About the RESONAC Group:
The RESONAC Group has been established January 2023 As a result of the integration of Showa Denko Group and SHOWA DENKO Materials Group (former Hitachi Chemical Group). Annual sales of semiconductors and electronic materials groups 340 billion yen。 This group is recognized by a wide range of semiconductor materials for back -end processes, which is the best market share worldwide. With the integration of the two companies, the Resonac Group has been able to design and develop materials from raw materials to finished products in -house. The new trade name “RESONAC” was created as a combination of two English words, the first character of chemistry, “resonance” and “C”. The RESONAC Group will actively use its co -creation platform to accelerate technological innovation with semiconductor manufacturers, material manufacturers, and equipment manufacturers. Japan And around the world.
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