AUSTIN, Jan. 21, 2025 (Globe Newswire) — Market size and growth insights:
According to SNS Insider, “The Semiconductor Disassembly Services market size was valued at USD 1.37 billion in 2023 and will reach USD 2.6 billion by 2032, at a CAGR of 7.37% over the forecast period 2024-2032. It is expected to grow.”
Semiconductor disassembly services market accelerates as demand for competitive intelligence grows
The semiconductor disassembly services market is expected to witness robust growth in 2024 due to the growing need for competitive intelligence and insight into complex semiconductor designs. Overall semiconductor sales (excluding memory) will decline by 3% in 2023, but the sector will grow as companies navigate a rapidly evolving landscape. The fast-growing generative AI chip market, expected to exceed USD 50 billion in 2024, highlights the importance of teardown services to analyze chip design, manufacturing, and component sourcing. A rebound in PC and smartphone sales, expected to grow 4% in 2024, highlights a resurgence in demand in key end markets, including data center chips, which will account for 56% of semiconductor sales in 2022 . The need for efficient sourcing and manufacturing strategies has made disassembly services essential.
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The major market players whose products are mentioned in this report are:
Benchmark Mineral Intelligence (EV battery disassembly and recycling analysis)Amadeus Capital Partners (semiconductor device reverse engineering)Jabil (product development, electronic component disassembly services)Keysight Technologies (semiconductor device testing, reverse engineering)Microchip Technology (micro controllers, semiconductor disassembly and recycling) analysis) Broadcom (networking, storage semiconductor disassembly) Texas Instruments (semiconductor component analysis and reverse engineering) Xilinx (FPGAs for AI/ML applications Device disassembly and reverse engineering) BELFOR USA Group Inc. (Disaster recovery, disassembly services) Chip One Stop, Inc. (Electronic component supply and analysis) Copperpod IP (Semiconductor IP services and analysis) Fictiv Inc. (Rapid prototyping, Disassembly Services)iFixit (Device Disassembly and Repair)Solutions)Informa Tech Holdings LLC (Technical Investigation and Disassembly Services)Insight Analytical Labs (Materials Testing, Reverse Engineering)Integrated Equipment Services Inc. (Electronic Equipment, Disassembly Services)Knometa Research Corp. (Semiconductor and Electronic Device Analysis)Lumenci (3D Printing) and Disassembly Services)Marvell Semiconductor (Network Semiconductor Disassembly)NanoPhysics BV (Nanoelectronics and Disassembly)Analysis)Nebula 3D Services ( 3D scanning and disassembly services)PennEngineering (electronic component disassembly and component testing)Power Products International Ltd. (semiconductor device testing and analysis)Prescient Technologies (semiconductor reverse engineering and IP Analysis)Prestige Technology (S) Pte. Ltd. (Semiconductor Device Testing and Analysis)Prestige Technology (S) Pte. Ltd. (Semiconductor Device Testing and Analysis) Ltd. (Electronics Disassembly and Analysis)PSI Semicon Services, Inc (Semiconductor testing and disassembly services)RASCO Automotive Systems Private Limited (Automotive electronics disassembly)Sofeast Limited (Electronics disassembly, reverse engineering)Symmetry Electronics by Exponential Technology Group (Electronic components and disassembly)Disassembly)TechPats (IP and reverse engineering services for semiconductors)Tektronix, Inc. (Semiconductor testing, reverse engineering, disassembly)
Semiconductor Disassembly Services Market Report Scope:
Report Attribute Details Market Size in 2023 $1.37 Billion Market Size by 2032 $2.60 Billion CAG RCAGR of 7.37% from 2024 to 2032 Report Scope and Scope Market Size, Segment Analysis, Competitive Environment, Regional Analysis, DROC and SWOT analysis, forecast outlook key segmentation • By method (force flow diagram, measurement and experiment, subtraction and calculation procedure)
• By device type (cameras, earphones, LEDs, microphones, smart doors and locks, smartphones and laptops, TVs, wearables)
• By application (circuit extraction and reverse engineering, competitive intelligence analysis, counterfeit screening database, semiconductor patent identification)
• Key drivers by end user (Automotive, Building & Construction, Consumer Electronics, Healthcare, IT & Telecommunications) • Technological advancements are driving the growth of the semiconductor disassembly services market.
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2023 Semiconductor Disassembly Services Market: Force Flow Methodology and Circuit Extraction Lead Innovation and Optimization
By method
In 2023, Force Flow (Energy Flow Field) method dominated the Semiconductor Disassembly Services market with a revenue share of 46%. This method analyzes energy flow within semiconductor devices and provides important insights into performance and inefficiency. Mapping energy dynamics provides a better understanding of functional integrity, helping you optimize your design and improve performance. Widely used in advanced devices such as microprocessors and power chips in automobiles, consumer electronics, and communications, its dominance is driven by the growing demand for energy-efficient solutions. Additionally, the ability to identify vulnerabilities makes it an essential tool in the semiconductor disassembly process.
By use
In 2023, the circuit extraction and reverse engineering segment accounted for approximately 41% of the semiconductor teardown services market revenue. The process involves disassembling semiconductor devices to extract circuit designs and functionality, which helps in technology replication, innovation, and intellectual property protection. This is important for analyzing chip architecture and performance, especially in the development of next-generation technologies. This segment is widely used in the consumer electronics, automotive and communications sectors and supports continuous innovation and optimization. Its growth is driven by increasing demand for high-performance chips, the complexity of modern designs, and the need to address intellectual property risk through competitive insights.
North America leads, Asia Pacific emerges as fastest growing region for semiconductor disassembly services market
In 2023, North America held the largest share in the semiconductor teardown services market, accounting for approximately 39% of the revenue. This dominance is primarily driven by the United States, which is home to major semiconductor manufacturers such as Intel, AMD, and NVIDIA, as well as technology giants such as Apple and Google. Government initiatives like the CHIPS Act will further stimulate demand for disassembly services.
Asia Pacific is expected to be the fastest growing region from 2024 to 2032 due to the expansion of semiconductor manufacturing base in China, South Korea, Japan, and Taiwan. Demand for disassembly services is being driven by advances in AI, automotive, 5G, and IoT technologies, as well as government drives to make semiconductor production self-reliant.
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recent developments
February 2024 – Samsung SSD 990 EVO: Major firmware update improves performance A recent firmware update for the Samsung SSD 990 EVO released in February 2024 optimizes the drive’s sequential write speed, as previously noted. Performance gaps have been addressed to improve overall efficiency and performance. Established itself as a top contender in the mainstream SSD market. September 13, 2024 – Apple Vision Pro Teardown Reveals Key Component Upgrades TechInsights’ recent teardown of Apple Vision Pro reveals an upgraded and unique application processor and enhancements aimed at improving mixed reality experiences. Significant advances have been made in its components, including improved display drivers. These upgrades underscore Apple’s commitment to positioning the Vision Pro as a leading device in both the consumer and professional AR markets.
Table of contents – main points
1. Introduction
2. Executive summary
3. Research method
4. Analysis of the impact of market dynamics
5. Statistical insights and trend reports
5.1 Number of teardowns carried out each year
5.2 Penetration of technology
5.3 Intellectual Property (IP) Risks and Violations
5.4 Technology adoption rate for automation
6. Competitive environment
7. Semiconductor Disassembly Services Market Segmentation, By Method
8. Semiconductor Disassembly Services Market Segmentation by Device Type
9. Semiconductor Disassembly Services Market Segmentation by Application
10. Semiconductor Disassembly Services Market Segmentation by End User
11. Regional analysis
12. Company profile
13. Use cases and best practices
14. Conclusion
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