Sales under the Chip Foundation co-development agreement are expected to continue through 2025
manchester, england, January 16, 2025 /PRNewswire/ — Smartkem (Nasdaq: SMTK), which is transforming the world of electronics with disruptive organic thin film transistors (OTFTs), completes first sale of TRUFLEX® semiconductor material to its consortium announced that it did. It is a development partner of Shanghai Chip Foundation Semiconductor Technology Co., Ltd. (“Chip Foundation”), a manufacturer of semiconductor and integrated circuit devices, and will be used in joint development of new generations of devices by Chip Foundation. microLED-based backlight technology for LCD displays.
Ian Jenks, Chairman and CEO of Smartkem, said: “The first sale of our single-layer dielectric material demonstrates the commercial viability of our advanced material both in the display industry and in other applications. “This is an important development milestone in our journey to establish a global business.”
Smartkem is supplying its proprietary organic dielectric monolayer material, or redistribution layer (RDL), to the Chip Foundation for combination with its microLED devices for the joint development of microLED-based device structures. The resulting fabricated chip has high brightness characteristics coupled with high current efficiency, which is expected to reduce power loss when driving backlights and improve illumination uniformity. Additional sales of RDL materials to the Chip Foundation are expected to continue throughout 2025.
“We are excited to work with Smartkem and integrate their TRUFLEX® material into our microLED devices,” said Dr. Maosheng Hao, Chairman of the Chip Foundation. “This represents a significant step forward in the advancement of solutions.” Increase efficiency to meet the evolving demands of the display industry. ”
About Smartchem
Smartkem is reshaping the world of electronics with disruptive organic thin film transistors (OTFTs) that have the potential to revolutionize the display industry. Smartkem’s patented TRUFLEX® liquid semiconducting polymers can be used to manufacture new types of transistors that can be used in many display technologies, including next-generation microLED displays. Smartkem’s organic inks enable low-temperature printing processes that are compatible with existing manufacturing infrastructure, providing lower-cost displays that outperform existing technologies.
Smartkem develops materials at its R&D facility in Manchester, UK and provides prototyping services at its Center for Process Innovation (CPI) in Sedgefield, UK. We have a local application office in Taiwan. The company has an extensive IP portfolio that includes 138 granted patents and 40 codified trade secrets across 18 patent families. To learn more, visit our website or follow us on LinkedIn.
About Shanghai Chip Foundation Semiconductor Technology Co., Ltd.
Through years of continuous research and practice, Shanghai Chip Foundation Semiconductor Technology Co., Ltd. has developed a comprehensive chemical lift-off (CLO) technology for gallium nitride (GaN) growth substrates and achieved mass production. The substrate plays an important role as the core support for the GaN material and chip. The Chip Foundation has successfully developed a new type of composite patterned sapphire substrate, the dielectric patterned sapphire substrate (DPSS), which is significantly different from the industry standard patterned sapphire substrate (PSS). Chip Foundation is able to reduce the dislocation density of GaN epitaxial layers on DPSS substrates to levels as low as 10^7/cm2 using precision facet-controlled epitaxial lateral overgrowth techniques. For large LED chips, the effect of dislocations is negligible, but for micro LED chips, the negative effects of dislocations become more and more obvious. The Chip Foundation has further revolutionized chemical lift-off growth substrate processing technology with the help of DPSS substrates. Compared with traditional laser lift-off methods, chemical lift-off shows superior performance in terms of cost-effectiveness and product yield. The laser lift-off process has a negative effect on the leakage performance of the chip, while the chemical lift-off process can effectively improve the leakage performance of the chip. This conclusion has been experimentally verified and its physical mechanism has been clearly explained.
These technologies can effectively promote the mass production of micro LED chips and can be used to produce mini thin-film flip-chip LED chips. The cost advantages are significant due to the fact that substrate thinning, laser scribing, and cracking processes are omitted, and few scribe channels are required between chips. The Chip Foundation has developed a wafer-level packaging technology based on thin-film chips and mini-LED backlight technology that can take full advantage of the superior performance of thin-film chips.
The advantages of GaN materials in electronic power and high frequency chips are also unparalleled. Our core technologies (DPSS substrate, lateral epitaxial growth technology, chemical lift-off substrate technology) can effectively solve the reliability and heat dissipation problems of electronic power and high frequency chips. The Chip Foundation looks forward to collaborating with a variety of stakeholders in these areas. various shapes.
Forward-looking statements
All statements in this press release that are not historical are forward-looking statements, including, among other things, market position and market opportunities, product development, manufacturing and sales expectations and plans, and relationships with partners and investors. It is a description. These statements are not historical facts and are based on current expectations, estimates and projections regarding Smartkem, Inc.’s business, operations and other similar or related factors. “may”, “would”, “could”, “would”, “should”, “anticipate”, “predict”, “could”, “continue” Words such as , “expect,” “intend,” “plan,” etc. We use words such as “anticipate,” “believe,” “estimate,” and other similar or sophisticated expressions to identify forward-looking statements; That’s not true. You should not place undue reliance on forward-looking statements because they involve known and unknown risks, uncertainties and assumptions that are difficult or impossible to predict and, in some cases, are beyond our control. Actual results may differ materially from those in the forward-looking statements as a result of many factors, including those described in the Company’s filings with the Securities and Exchange Commission. We undertake no obligation to revise or update the information in this release to reflect future events or circumstances, even if new information becomes available.
contact address:
selena kirkwood
Head of Communications at Smartkem
Phone: +44 (0) 7971 460 364
s.kirkwood@smartkem.com
US investor
David Barnard, CFA
Alliance Advisor Investor Information
Phone: 1 415 433 3777
dbarnard@allianceadvisors.com
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SOURCE SmartKem, Inc.
