NXP Semiconductors (NASDAQ: NXPI) has secured a €1 billion loan from the European Investment Bank (EIB) to advance semiconductor innovation across Europe. The loan, carrying an approximate 4.75% interest rate for dollar-denominated tranches, has a six-year duration and will support NXP’s research, development, and innovation (RDI) efforts in Austria, France, Germany, The Netherlands, and Romania through 2026.
The funding aligns with EIB’s ‘Strategic Tech-EU’ investment program and the EU Chips Act, focusing on critical technologies including artificial intelligence, microchips, and quantum computing. NXP will utilize the funds to develop next-generation automotive processors, advanced radar solutions, energy systems, and secure edge technologies. The investment aims to strengthen Europe’s semiconductor ecosystem and supports NXP’s involvement in the ESMC joint venture fab in Germany.
NXP Semiconductors (NASDAQ: NXPI) ha ottenuto un prestito di 1 miliardo di euro dalla Banca Europea per gli Investimenti (BEI) per promuovere l’innovazione nei semiconduttori in tutta Europa. Il prestito, con un tasso di interesse approssimativo del 4,75% per le tranche denominate in dollari, ha una durata di sei anni e supporterà gli sforzi di ricerca, sviluppo e innovazione (RDI) di NXP in Austria, Francia, Germania, Paesi Bassi e Romania fino al 2026.
I finanziamenti sono in linea con il programma di investimento ‘Strategic Tech-EU’ della BEI e con la legge europea sui chip, concentrandosi su tecnologie critiche come l’intelligenza artificiale, i microchip e il calcolo quantistico. NXP utilizzerà i fondi per sviluppare processori automobilistici di nuova generazione, soluzioni radar avanzate, sistemi energetici e tecnologie di edge computing sicure. L’investimento mira a rafforzare l’ecosistema europeo dei semiconduttori e supporta il coinvolgimento di NXP nella fabbrica della joint venture ESMC in Germania.
NXP Semiconductors (NASDAQ: NXPI) ha conseguido un préstamo de 1.000 millones de euros del Banco Europeo de Inversiones (BEI) para avanzar en la innovación de semiconductores en toda Europa. El préstamo, que lleva una tasa de interés aproximada del 4,75% para las tramos denominados en dólares, tiene una duración de seis años y apoyará los esfuerzos de investigación, desarrollo e innovación (I+D+I) de NXP en Austria, Francia, Alemania, Países Bajos y Rumanía hasta 2026.
La financiación se alinea con el programa de inversión ‘Strategic Tech-EU’ del BEI y con la Ley de Chips de la UE, centrándose en tecnologías críticas como la inteligencia artificial, los microchips y la computación cuántica. NXP utilizará los fondos para desarrollar procesadores automotrices de nueva generación, soluciones avanzadas de radar, sistemas energéticos y tecnologías de borde seguras. La inversión tiene como objetivo fortalecer el ecosistema de semiconductores de Europa y apoya la participación de NXP en la fábrica conjunta ESMC en Alemania.
NXP 반도체 (NASDAQ: NXPI)는 유럽 투자 은행(EIB)으로부터 10억 유로의 대출을 확보하여 유럽 전역에서 반도체 혁신을 추진합니다. 이 대출은 달러로 표시된 일부에 대해 약 4.75%의 이자율을 가지고 있으며, 6년의 기간을 가지며, 2026년까지 오스트리아, 프랑스, 독일, 네덜란드 및 루마니아에서 NXP의 연구, 개발 및 혁신(RDI) 노력을 지원합니다.
이 자금 지원은 EIB의 ‘전략적 기술 EU’ 투자 프로그램 및 EU 칩법에 부합하며, 인공지능, 마이크로칩, 양자 컴퓨팅 등 중요한 기술에 초점을 맞추고 있습니다. NXP는 이 자금을 사용하여 차세대 자동차 프로세서, 고급 레이더 솔루션, 에너지 시스템 및 안전한 엣지 기술을 개발할 것입니다. 이 투자는 유럽의 반도체 생태계를 강화하고 독일의 ESMC 합작 투자 공장에서 NXP의 참여를 지원하는 것을 목표로 합니다.
NXP Semiconductors (NASDAQ: NXPI) a obtenu un prêt d’un milliard d’euros de la Banque Européenne d’Investissement (BEI) pour faire avancer l’innovation en matière de semi-conducteurs à travers l’Europe. Le prêt, portant un taux d’intérêt d’environ 4,75% pour les tranches libellées en dollars, a une durée de six ans et soutiendra les efforts de recherche, de développement et d’innovation (RDI) de NXP en Autriche, en France, en Allemagne, aux Pays-Bas et en Roumanie jusqu’en 2026.
Ce financement est en adéquation avec le programme d’investissement ‘Strategic Tech-EU’ de la BEI et la loi européenne sur les puces, en se concentrant sur des technologies critiques telles que l’intelligence artificielle, les microchips et l’informatique quantique. NXP utilisera ces fonds pour développer des processeurs automobiles de nouvelle génération, des solutions radar avancées, des systèmes énergétiques et des technologies de sécurité en périphérie. L’investissement vise à renforcer l’écosystème européen des semi-conducteurs et soutient l’implication de NXP dans la fabrique conjointe ESMC en Allemagne.
NXP Semiconductors (NASDAQ: NXPI) hat einen Kredit in Höhe von 1 Milliarde Euro von der Europäischen Investitionsbank (EIB) gesichert, um die Innovation im Bereich der Halbleiter in ganz Europa voranzutreiben. Der Kredit, der einen ungefähr 4,75%igen Zinssatz für in Dollar denominierten Tranchen trägt, hat eine Laufzeit von sechs Jahren und wird die Forschungs-, Entwicklungs- und Innovations (RDI)-Bemühungen von NXP in Österreich, Frankreich, Deutschland, den Niederlanden und Rumänien bis 2026 unterstützen.
Die Finanzierung steht im Einklang mit dem Investitionsprogramm ‘Strategic Tech-EU’ der EIB sowie mit dem EU-Chips-Gesetz und konzentriert sich auf kritische Technologien wie künstliche Intelligenz, Mikrochip und Quantencomputing. NXP wird die Mittel nutzen, um fortschrittliche Automobilprozessoren, moderne Radarlösungen, Energiesysteme und sichere Edge-Technologien zu entwickeln. Die Investition zielt darauf ab, das Halbleiter-Ökosystem in Europa zu stärken und NXP’s Beteiligung an der gemeinsamen ESMC-Fabrik in Deutschland zu unterstützen.
Positive
Secured €1 billion in financing for R&D expansion
Favorable 4.75% interest rate on dollar-denominated tranches
Strategic alignment with EU Chips Act and government initiatives
Investment supports expansion in five European countries
Negative
Additional debt burden with new €1 billion loan
Six-year financial commitment in volatile semiconductor market
Insights
The €1 billion EIB loan represents a strategic financial win for NXP, secured at a relatively attractive 4.75% interest rate in the current high-rate environment. The 6-year term provides substantial operational flexibility while strengthening NXP’s liquidity position. This funding structure is particularly advantageous as it supports R&D without diluting shareholders or significantly impacting the balance sheet negatively.
The loan’s dollar-denominated tranches option adds valuable currency risk management flexibility, especially important given NXP’s global operations and revenue streams. Compared to current corporate bond yields, this financing appears competitively priced, potentially saving NXP several basis points in interest expenses annually.
This funding positions NXP strategically in Europe’s semiconductor sovereignty initiative, aligning perfectly with the EU Chips Act and regional tech independence goals. The focus on automotive processors, radar solutions and edge AI development targets high-growth segments where NXP already holds competitive advantages. The investment in five EU countries (Austria, France, Germany, Netherlands, Romania) creates a robust R&D network that can accelerate innovation cycles.
The connection to the ESMC joint venture fab in Germany is particularly noteworthy, as it creates a complete value chain from R&D to manufacturing within the EU. This integrated approach could give NXP a significant competitive advantage in the automotive and industrial IoT markets, where supply chain reliability is crucial.
The timing of this loan coincides with growing demand for automotive semiconductors and increased focus on vehicle electrification. NXP’s strategic emphasis on power electronics and energy efficiency aligns with major market trends in automotive and industrial sectors. The loan’s support for AI and edge computing research positions NXP to capitalize on the projected $1.3 trillion automotive semiconductor market by 2030.
For investors, this development signals strong government backing and reduced execution risk for NXP’s European expansion plans. The loan’s structure and terms suggest minimal impact on near-term earnings while providing substantial growth potential through enhanced R&D capabilities.
01/15/2025 – 09:00 AM
€1 billion EIB loan will help fuel NXP’s research, development, and innovation (RDI) efforts in Austria, France, Germany, The Netherlands and Romania Loan will accelerate NXP’s RDI aimed at various end markets including automotive, Industrial, and Internet of Things (IoT)Supporting critical EU technology is a key EIB priority as outlined in its strategic roadmap and furthers EIB’s commitment to the EU Chips Act
LUXEMBOURG and EINDHOVEN, The Netherlands, Jan. 15, 2025 (GLOBE NEWSWIRE) — NXP Semiconductors N.V. (NASDAQ: NXPI) today announced that it has secured a €1 billion loan from the European Investment Bank (EIB) to advance the company’s RDI investments across its broad portfolio of semiconductor solutions. The €1 billion loan facility carries an approximate interest rate of 4.75 percent when drawn in dollar denominated tranches, under the current market conditions and has a duration of six years. The financing will support NXP’s research and development efforts in several EU Member States, implemented in its facilities in Austria, France, Germany, the Netherlands and Romania for the period up to 2026.
The financing of critical European technology aligns with the EIB’s launch of a targeted “Strategic Tech-EU” investment programme to accelerate digitalisation and innovation in strategic technologies, such as artificial intelligence, microchips, life sciences and quantum computing. Semiconductors are the fundamental building blocks critical to the digitalisation of many different industries, making them instrumental in public and private efforts to advance decarbonisation and sustainability efforts.
“It is fundamental for Europe to remain an indispensable player in the value chain of critical technologies and build RDI and production capacity in those supply chains,” stated EIB vice president Robert de Groot. “Luckily, the EU boasts some of the world’s most advanced chip makers. As semiconductors are key to the digital and green transitions, their importance will only grow, and the EIB proudly supports such strategic technology.”
NXP research and development teams across Europe are focused on creating the next generation of automotive processors, advanced automotive radar solutions, improved energy and driver systems, in-vehicle networking, and secure car access, in addition to other equally important intelligent edge technologies such as artificial intelligence (AI), secure edge identification, Near Field Communication (NFC) wallets for mobile phones and smart wearables, and other devices which improve quality of life and further sustainability efforts.
“NXP is committed to strengthening Europe’s semiconductor ecosystem, and this significant loan from EIB aims at bolstering NXP’s efforts in research and development across many of our EU sites,” said Maarten Dirkzwager, Executive Vice President and Chief Strategy Officer at NXP. “NXP’s collaboration with the EIB underscores our commitment to ensuring European technology leadership and sustainability in the global semiconductor market. This loan complements the various existing instruments supporting our industry, such as the Important Projects of Common European Interest (IPCEI) and other initiatives currently being set up by the European Commission and the Member States. It is also consistent with our investment in the ESMC joint venture fab currently being built in Germany, which will address Europe’s automotive and industrial chip requirements.”
The investment will contribute to building a state-of-the-art European chip ecosystem, in-line with the EU Chips Act, the Dutch Semicon Valley and the National Technology Strategy of the Netherlands’ Government, whose scope is to strengthen the semiconductor market in the EU to ensure a secure and competitive supply of chips. Apart from the pure research and development of new power electronics devices, microprocessors and microcontrollers, NXP will also focus on the energy efficiency of its devices.
Background Information:
The European Investment Bank (EIB) is the long-term lending institution of the European Union, owned by its Member States. The Netherlands owns a 5,2% share of the EIB. It makes long-term finance available for sound investment in order to contribute towards EU policy goals and national priorities. More than 90% of its activity is in Europe. Over the last ten years, the EIB has made available more than €27 billion in financing for Dutch projects in various sectors, including research & development, sustainable mobility, drinking water, healthcare and SMEs.
NXP Semiconductors N.V. (NASDAQ: NXPI) is the trusted partner for innovative solutions in the automotive, industrial & IoT, mobile, and communications infrastructure markets. NXP’s “Brighter Together” approach combines leading-edge technology with pioneering people to develop system solutions that make the connected world better, safer, and more secure. The company has operations in more than 30 countries and posted revenue of $13.28 billion in 2023. Find out more at www.nxp.com.
Press contacts:
EIB: Tim Smit | +352 691 286423 | t.smit@eib.org
NXP: Martijn van der Linden | +31 610914896 | martijn.van.der.linden@nxp.com
NXP-Corp
FAQ
What is the interest rate and duration of NXPI’s new EIB loan?
The €1 billion loan facility carries an approximate 4.75% interest rate for dollar-denominated tranches and has a duration of six years.
Which European countries will benefit from NXPI’s R&D investments?
The financing will support NXP’s research and development efforts in Austria, France, Germany, the Netherlands, and Romania through 2026.
How does the EIB loan align with European semiconductor initiatives?
The loan aligns with the EU Chips Act and EIB’s Strategic Tech-EU investment programme, supporting critical European technology development and semiconductor innovation.
What technologies will NXPI develop with the EIB loan funding?
NXP will develop automotive processors, advanced radar solutions, energy systems, in-vehicle networking, secure car access, AI, and secure edge identification technologies.
How does this loan support NXPI’s European manufacturing plans?
The loan complements NXP’s investment in the ESMC joint venture fab being built in Germany, which will address Europe’s automotive and industrial chip requirements.
