Further leaks regarding NVIDIA’s GeForce RTX 5090 GPU have surfaced online, revealing details of the PCB layout, particularly the power stage design and layering.
NVIDIA’s next-generation flagship GPU is ‘boosted’ with top-level specs as PCB details revealed online
NVIDIA’s RTX 50 “Blackwell” flagship GPU is looking increasingly familiar to us in terms of expected specs, given that rumors have been spreading rapidly lately as we get closer to official announcement details. I think so. Benchlife’s report states that Team Green plans to integrate a 16+6+7 power phase design. This is a different configuration than what we saw on the GeForce RTX 4090 (20+3).
Additionally, the GeForce RTX 5090 is also rumored to feature a 14-layer PCB design, although this will be limited to certain models, in which case a reference model may be discussed. Other details in the report validate previous leaks of the GeForce RTX 5090, and based on the information available so far, NVIDIA’s next flagship GPU could be:
Blackwell GB202-300 32 GB GDDR7 Memory 600W TDP 16+6+7 Power Phase Design 1x 12V-2×6 (16 Pin) Connector PCIe 5.0 Express Slot
To find out how this model performs, check out our roundup on the GeForce RTX 5090, including expected performance and price. I also recently got my first look at the GPU PCB design. Not only does the onboard silicon look larger than ever, but the IHS has been strengthened to keep up with the GPU’s thermal performance. Overall, the GeForce RTX 5090 is likely to stand out as the only contender in the high-end segment, so expect a big jump in gaming performance.
The NVIDIA GeForce RTX 5090 will be the flagship GPU and is expected to be available by the end of January or early February. Stay tuned for more information on the next-gen lineup at CES 2025 in the coming weeks. Exciting times are certainly ahead.
News source: Videocardz
