Tower Semiconductor (NASDAQ/TASE: TSEM) announced the release of its new 300mm Silicon Photonics (SiPho) process as a standard foundry product. This advanced process complements the existing 200mm (PH18) platform currently in mass production. This new product features industry-leading silicon waveguide and advanced low-loss silicon nitride waveguide technology. The larger wafer size improves compatibility with industry standard OSAT platforms, improves integration with electronics, and increases efficiency.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced a standard manufacturing process for Photonica Silicone 300mm (SiPho). Questo executes the perfect process of 200mm (PH18) Piata form to achieve maximum volume. Nuova presents and guides Silicio’s leader Nel Settre and Nitro di Silicio’s Avanzata di guide. Setting OSAT standards, integrating electronic components, and agreeing on efficient components.
Tower Semiconductor (NASDAQ/TASE: TSEM) is processing new photos for its 300mm (SiPho) financing. We are working to complement the existing platform of 200mm (PH18) and significantly improve the actual manufacturing. Develop new technologies and develop new technologies in line with industry and technological advances. The Mayor will allow major integration of industrial OSAT, electronics and efficiency improvements.
Tower Semiconductor (NASDAQ/TASE: TSEM) 300mm module (SiPho) module. This product is 200mm (PH18). I want to know what I’m talking about I want to know what I want. OSAT It’s a good idea.
Tower Semiconductor (NASDAQ/TASE: TSEM) announced a standard manufacturing process for its 300mm silicon (SiPho) photonic process. Fully pre-process existing plate shapes of 200mm (PH18) and silently run high-volume production. Utilizing the industry’s most advanced silicone guides and advanced technology, we have developed a new, accurate silicone guide. Compatible with large wafer stability and plate format OSAT industry standards, contributing to lasting superior integration and increased efficiency of electronic components.
Tower Semiconductor (NASDAQ/TASE: TSEM) uses 300 mm Silizium-Photonik (SiPho)-Verfahrens als Standard-Fertigungsofferte angekündigt. Dieses fortschrittliche Verfahren ergänzt ihre bestehende 200mm (PH18) platform, product of Hochvolumenproduktion ist. The new Angebot administration powers silidium nitride and wellenrite technology. The integration of OSAT-Plattformen and ermöglicht eine bessere is integrated into Bauteilen with Effizienz functionality.
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Expands product portfolio with introduction of new 300mm silicon photonics process Enhances compatibility with industry standard OSAT platforms Builds on existing high-volume 200mm platform
insight
The release of this 300mm silicon photonics process represents a significant technological advancement in Tower Semiconductor’s manufacturing capabilities. Moving from 200mm to 300mm wafers offers significant cost efficiencies and increased production capacity. This is a key element in meeting the rapidly growing data center market. Increasing wafer size typically reduces cost per chip by 20-30% and significantly increases throughput.
The platform’s compatibility with standard OSAT integration can accelerate customer adoption and reduce time to market for new products. Improved silicon waveguides and low-loss silicon nitride capabilities could give Tower a competitive edge in high-performance computing and AI, where data transmission speeds are critical. However, the overall revenue impact will depend on customer migration rates and market demand for these advanced solutions.
November 26, 2024 – 6:00 AM
Meet the evolving needs of next-generation datacom applications with industry-leading figures of merit
Migdal Hemek, Israel, November 26, 2024 – Tower Semiconductor (NASDAQ/TASE: TSEM), a leading foundry of high-value analog semiconductor solutions, today announced the release of its new 300mm Silicon Photonics (SiPho) process as a standard foundry product. Announced. . This advanced process complements the tower’s established 200mm (PH18) platform, which is currently in mass production, and is a state-of-the-art technology tailored to meet the growing need for high-speed data communications for next-generation datacom applications. Deliver solutions to customers.
The unique 300mm product features best-in-class silicon waveguides and the industry’s most advanced low-loss silicon nitride waveguide products. The larger wafer size increases compatibility with industry-standard OSAT (Outsourced Semiconductor Assembly and Test) platforms, facilitates seamless integration with electronic components, and improves overall efficiency.
Dr. Edward Preisler, Vice President and General Manager of RF Business, said: “We are proud to introduce our new advanced silicon photonics products, which provide a seamless path for our existing customers to transition to next-generation technology on 300mm wafers.” . “This process is built on Tower’s industry-leading 200mm SiPho platform for continuous process enhancement and increased supply flexibility for our customers.”
Learn more about Tower’s RF and HPA technology platform.
About Tower Semiconductor
Tower Semiconductor Ltd. (NASDAQ/TASE: TSEM) is a leading foundry of high-value analog semiconductor solutions, providing technology, development, and process platforms to customers in growing markets such as consumer, industrial, automotive, mobile, infrastructure, and medical. I’m doing it. and aerospace and defense. Tower Semiconductor contributes to the world through long-term partnerships and the provision of advanced, innovative analog technology consisting of a wide range of customizable process platforms including SiGe, BiCMOS, mixed-signal/CMOS, and RF CMOS. We focus on making a sustainable impact. , CMOS image sensors, non-imaging sensors, displays, integrated power management (BCD and 700V), photonics, and MEMS. Tower Semiconductor also provides IDM and fabless companies with world-class design enablement for fast and accurate design cycles and process transfer services, including development, relocation, and optimization. To provide multi-fab sourcing and capacity expansion for customers, Tower Semiconductor has two facilities in Israel (150mm and 200mm), two in the United States (200mm), and two in Japan (200mm and 300mm). owns a 51% stake in the company. TPSCo shares a 300mm facility in Agrate, Italy with ST and also has access to Intel’s new 300mm capacity corridor. Mexico factory. For more information, please visit www.towersemi.com.
Safe harbor for forward-looking statements
This press release contains forward-looking statements that are subject to risks and uncertainties. Actual results may differ from those anticipated or implied by such forward-looking statements. A complete discussion of the risks and uncertainties that may affect the accuracy of the forward-looking statements contained in this press release or that may affect Tower’s operations is available on Form 20-F and 6 included under the heading “Risk Factors” in Tower’s most recent filings. -K, filed with the Securities and Exchange Commission (“SEC”) and the Israeli Securities Authority. Tower does not intend to update, and expressly disclaims any obligation to update, the information contained in this release.
Tower Semiconductor Investor Information Contact: Noit Levy | +972-4-604-7066 | noitle@towersemi.com
Tower Semiconductor Company Contact: Orit Shahar | +972-74-7377440 | oritsha@towersemi.com
FAQ
What new technology will Tower Semiconductor (TSEM) release in November 2024?
Tower Semiconductor has released a new 300mm Silicon Photonics (SiPho) process as a standard foundry product.
What are the key features of Tower Semiconductor’s (TSEM) new 300mm silicon photonics process?
The process features best-in-class silicon waveguides, advanced low-loss silicon nitride waveguide products, and enhanced compatibility with industry standard OSAT platforms.
How does Tower Semiconductor’s (TSEM) new 300mm SiPho process complement existing technology?
The new 300mm process complements Tower’s existing 200mm (PH18) platform, which is currently in volume production, and provides customers with a seamless migration path to next-generation technology.
