The Department of Commerce is investing up to $300 million to accelerate this policy. Technology development that supports the semiconductor industry.
The department announced Thursday that three organizations, each receiving up to $100 million in federal funding, will conduct advanced packaging research projects aimed at fostering innovation in semiconductor research, development and manufacturing. Including private sector investment, the total funding for the three projects is expected to exceed $470 million.
Advanced packaging using advanced substrates
An investment support project related to advanced substrates that form the basis of advanced packaging. These physical platforms enable seamless assembly of semiconductor chips, high-bandwidth communication between those chips, and efficient power delivery and dissipation of unnecessary heat.
Proposed advanced packaging research project
Recipients of competitively awarded research investments are:
Absolics is a Covington, Georgia-based company focused on developing glass-core substrate panel manufacturing through advanced substrate and materials research and technology packaging programs.
Applied Materials, located in Santa Clara, Calif., leads a team of 10 people in the development and expansion of innovative silicon-core substrate technology. This is utilized for advanced packaging and 3D heterogeneous integration.
Arizona State University in Tempe is working on using fan-out wafer-level processing for microelectronics packaging.
“Emerging technologies like AI require cutting-edge advances in microelectronics, including advanced packaging,” the Secretary of Commerce said. Gina Raimondo. “Through these investment proposals, we will position the United States as a world leader in microelectronics design, manufacturing, and packaging that powers tomorrow’s innovation.”
Laurie Locascio“Advanced packaging is essential to the development of advanced semiconductors that power emerging technologies such as artificial intelligence,” said the Under Secretary of Commerce for Standards and Technology and Director of the National Institute of Standards and Technology.
