credit: A. Kim/NIST
Media Contact: Hannah Robinson hannah robinson (in) chips.gov
Today, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) will invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to develop cutting-edge technologies essential to society. It was announced that negotiations have begun to accelerate. semiconductor industry. The expected winners are Absolics Inc. in Georgia, Applied Materials Inc. in California, and Arizona State University in Arizona.
These competitively awarded research investments are each expected to total $100 million and represent new efforts in advanced substrates. Advanced substrates are physical platforms that allow multiple semiconductor chips to be assembled seamlessly, enable high-bandwidth communication between those chips, efficiently deliver power, and dissipate unnecessary heat. Advanced packaging enabled by advanced substrates will lead to high-performance computing for AI, next-generation wireless communications, and more efficient power electronics. Although such substrates are not currently produced in the United States, they are the basis for establishing and expanding domestic advanced packaging capabilities. Up to $300 million in federal funding will be combined with additional investment from the private sector, bringing the total projected investment for all three projects to more than $470 million. This joint effort will ensure that U.S. manufacturers remain competitive and continue to drive innovation, giving companies a stronger advantage in global competition.
“The key to America’s long-term competitiveness depends on our ability to innovate and build better than the rest of the world. That’s why the research and development aspect of the CHIPS for America program is so fundamental to America’s success. The proposed investment in advanced packaging underscores the efforts we are making to prioritize every step of the semiconductor supply chain pipeline,” said U.S. Secretary of Commerce Gina Raimondo. Ta. Thanks to the leadership of President Biden and Vice President Harris, and through these investment proposals, the United States is positioning itself as a world leader in the design, manufacturing, and packaging of microelectronics that power tomorrow’s innovations. ”
“Today’s award is critical to ensuring America’s global semiconductor leadership and ensuring our supply chain here in the United States is cutting-edge from end to end,” said National Economic Advisor Lael Brainard. I guarantee you that.”
Increasing power consumption, computational performance in AI data centers, and scalability in mobile electronics cannot be solved with current packaging technology. Sustaining these future industries in the United States will require innovation at all levels. The CHIPS National Advanced Packaging Manufacturing Program (NAPMP) has set aggressive technology goals for substrates that all three entities are expected to meet or exceed. Advanced substrates are the foundation of advanced packaging, which power key advanced packaging technologies including equipment, tools, processes, process integration, and more. These projects will play a critical role in ensuring that American innovation drives cutting-edge advances in semiconductor research and development (R&D) and manufacturing.
“Advanced packaging is essential to the development of advanced semiconductors that power emerging technologies such as artificial intelligence,” said Laurie E. LoCascio, Assistant Secretary of Commerce and Director of the Office of Standards and Technology. With the introduction of the National Advanced Packaging Manufacturing Program, CHIPS’ critical Breakthroughs that address needs are driven. state. ”
The proposed projects are:
Absolics, Inc., Covington, Georgia: Absolics advances the manufacturing of glass-core substrate panels by developing cutting-edge capabilities in partnership with more than 30 partners, including academic institutions, large and small businesses, and nonprofit organizations. is poised to bring about a revolution. The beneficiary is in the glass materials and substrates sector and can raise up to $100 million. Absolics aims to build a glass-core packaging ecosystem through its Substrates and Materials Advanced Research and Technology (SMART) packaging program. In addition to developing the SMART Packaging Program, Absolics and its partners support education and workforce development efforts by introducing training, internship, and certification opportunities to technical colleges, HBCU CHIPS networks, and veterans programs. I’m planning to. Through these efforts, Absolix advances current glass-core substrate panel technology and supports investments in future high-volume manufacturing capabilities. Applied Materials, Santa Clara, California: Applied Materials, with a team of 10 collaborators, extends innovative silicon core substrate technology to the next generation of advanced packaging and 3D heterogeneous integration. Applied’s silicon core substrate technology advances U.S. leadership in advanced packaging and creates an ecosystem for developing and building next-generation energy-efficient artificial intelligence (AI) and high-performance computing (HPC) systems in the U.S. has the potential to promote Additionally, Applied Materials’ education and workforce development plan is designed to strengthen the training and internship pipeline between state universities and the semiconductor industry in the United States. Arizona State University in Tempe, Arizona: Arizona State University is leading the way in the development of: Generation of microelectronic packaging through fan-out wafer-level processing (FOWLP). At the center of this effort is the ASU Advanced Electronics and Photonics Core Facility, where researchers are studying the commercial feasibility of 300 mm wafer-level and 600 mm panel-level manufacturing. This technology does not exist in commercial capacity in the world. United States today. ASU’s team of more than 10 partners, led by industry pioneer Deca Technologies, is centered around the region’s microelectronics manufacturing footprint, serving large corporations, small businesses, universities, colleges, and nonprofit organizations. configured. The team spans the United States and includes industry leaders in materials, equipment, chiplet design, electronic design automation, and manufacturing. ASU will establish an interconnect foundry that will connect advanced packaging and workforce development programs with semiconductor fabs and manufacturers. ASU’s education and workforce development initiatives provide industry-relevant training, including train-the-trainer, microcredentials, and quick start programs for working professionals. The participation of the HBCU CHIPS Network and the National Center for American Indian Enterprise Development is essential to workforce development planning.
About CHIPS for America
CHIPS for America is part of President Biden’s economic plan to invest in America, stimulate private sector investment, create good-paying jobs, increase income in the United States, and revitalize marginalized communities. It is. CHIPS for America includes the CHIPS Program Office, which is responsible for manufacturing incentives, and the CHIPS Research and Development (R&D) Office, which is responsible for R&D programs. Both offices are located within the Department of Commerce’s National Institute of Standards and Technology (NIST). NIST fosters U.S. innovation and industrial competitiveness by advancing measurement science, standards, and technology in ways that strengthen economic security and improve quality of life. NIST is uniquely positioned to successfully manage the CHIPS for America program because of its strong relationships with U.S. industry, deep understanding of the semiconductor ecosystem, and reputation for being fair and trustworthy. For more information, please visit https://www.chips.gov.
About CHIPS National Advanced Packaging Manufacturing Program (NAPMP)
To realize the CHIPS Research and Development Office’s vision of success, the CHIPS National Advanced Packaging Manufacturing Program will invest approximately $3 billion to develop significant innovations related to advanced packaging technologies and increase U.S. manufacturing operations. It is planned to accelerate the large-scale transition to the body. These investments include core technology research programs that can be scaled to high-volume production, advanced packaging testing facilities to support this expansion, resources to support the expansion of advanced packaging solutions, and workforce development. . As a result, within 10 years, the combination of NAPMP-funded activities and CHIPS manufacturing incentives will result in a vibrant, self-sustaining, high-volume, domestically advanced package in which U.S.-manufactured advanced node chips will be packaged. industry will be established. US. The developed technology will be utilized on a large scale in new applications and market areas.
