Rapidus Chiplet Solutions, a new research and development facility and cleanroom; seiko epson’s Chitose Campus
Tokyo and Hokkaido, Japan, October 3, 2024 /PRNewswire/ — Rapidus Corporation, a company involved in the research, development, design, manufacturing and sales of cutting-edge logic semiconductors, today announced that it will install a clean room at the Seiko Epson Corporation facility in Chitose. Hokkaidoand will open a semiconductor post-processing research and development (R&D) center called Rapidus Chiplet Solutions (RCS).
The Seiko Epson Chitose factory is adjacent to the Lapidus Innovative Integration for Manufacturing (IIM) Foundry, a semiconductor manufacturing facility that Lapidus is currently constructing in Bibi, Chitose City. The new research and development space was unveiled at a groundbreaking ceremony held today, with a clean room area of approximately 2,000 square meters. 9,000m2 (96,875 square feet). Rapidus will leverage its new R&D facility to develop mass production technology for chiplet packaging.
Rapidus begins installation of manufacturing equipment April 2025research and development activities are scheduled to begin in . April 2026. RCS will have pilot lines for FCBGA, Si interposers, RDL, and hybrid bonding processes, and will conduct additional research and development on volume production technologies, including equipment automation.
In the development of post-processing and chiplet integration technology, the Ministry of Economy, Trade and Industry and the New Energy and Industrial Technology Development Organization have approved the project “Chiplet package design and manufacturing technology development for 2nm generation semiconductors”. in April 2024development of core technologies such as chiplet integration and 2.5D/3D packaging is progressing.
in June 2024Rapidus has entered into a partnership with IBM for chiplet technology as well as front-end processes. Additionally, Rapidus supports LSTC, AIST, University of TokyoFraunhofer Germany And A*star im in Singapore Toward the further evolution of packaging.
About Rapidus Co., Ltd.:
Rapidus Corporation aims to develop and manufacture the world’s most advanced logic semiconductors. We will create new industries together with our customers by developing and providing services that shorten cycle times such as design, wafer processing, and 3D packaging. We will continue to take on the challenge of contributing to the enrichment, richness, and happiness of people’s lives through semiconductors.
About Rapidus Co., Ltd.
Head office: 4-1 Kojimachi, Chiyoda-ku, Tokyo Tokyo 102-0083, Japan
Established: August 10, 2022
management: Tetsuro HigashiChairman of the Board
Atsuyoshi KoikeRepresentative Director and President
Business content: Research, development, design, manufacturing, and sales of semiconductor devices, integrated circuits, and other electronic components
Capital (current) November 2022): 7,346 million yen (Including capital reserves)
Media contact:
Devan Gillick – Breakaway communication Lapidus
Email: (email protected)
Mobile: (530) 591-3194
Source Rapidus Co., Ltd.
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