Citing sources, the Commercial Times reported that NVIDIA has made changes to the six-layer GPU mask for its Blackwell series, minimizing production delays and allowing the process to proceed without re-taping out.
According to the report, NVIDIA’s updated B200 is expected to be completed by late October, while the GB200 will enter mass production in December, with large-scale deliveries to ODMs expected in the first quarter of next year.
Previously, a report from The Information had said that NVIDIA’s GB200 was one quarter behind in volume shipments, while another report from Economic Daily News further suggested that the issue was likely to be with the yield rate of advanced packages, primarily affecting non-reference designed GB200 chips.
Industry sources cited by the Commercial Times said that Nvidia’s Blackwell chips faced instability issues in the metal layer during the HV process, but that these were resolved by July.
Also, since the issue was reported to have occurred in the back-end process, it was determined that a new tape-out was not necessary. However, since the capacity of CoWoS-L is still a bottleneck, CoWoS-S is expected to be adopted in advanced packaging for GB200 this year.
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(Photo courtesy of NVIDIA)
This article cites the following sources: Commercial Times, information and Economic Daily News.
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