Rensselaer Polytechnic Institute and Hokkaido University today announced plans to explore collaboration opportunities in semiconductor education and research that will contribute to the Semiconductor Workforce Development Initiative.
The two universities acknowledged the new partnership during a letter of intent signing ceremony held at the Curtis R. Priem Center for Experimental Media and Performing Arts, which was attended by faculty and student representatives from the Hokkaido Prefectural Government, Japanese semiconductor company Rapidus, IBM, NY CREATES, and RPI.
Prior to the signing ceremony, the Japanese delegation toured the IBM Quantum System One at RPI, the world’s first system to be deployed on a university campus. Quantum systems, an entirely new field of computing, rely on breakthroughs in hardware and systems engineering that advance the capabilities of quantum processors.
It is estimated that the global semiconductor industry will need to add more than one million workers by 2030 to meet demand for chips, which are used in everything from computers and smartphones to cars and home appliances.
“RPI is honored to welcome Hokkaido University, Hokkaido Prefecture, and other distinguished guests to launch an exciting partnership in support of chip manufacturing and innovation,” said RPI President Martin A. Schmidt (Ph.D., Class of ’81). “Today was a great example of how universities, companies, and governments can and must work together to meet the workforce needs of an industry that touches so much of modern life.”
Hokkaido University President Kiyohiro Takagane said, “Hokkaido University is accelerating its efforts to develop systems for cultivating highly skilled human resources and promoting research in the semiconductor field. By deepening our collaborative relationship with Rensselaer Polytechnic Institute, which is conducting cutting-edge research in the semiconductor field in the United States, we believe we can contribute to providing higher quality education and improving our research capabilities.”
“I believe that Hokkaido and Rensselaer Polytechnic Institute have a strong connection. We have a long history together, and we hope to continue building on it,” said Hokkaido Governor Naomichi Suzuki. “I believe this collaboration between Rensselaer Polytechnic Institute and Hokkaido University will accelerate Hokkaido’s human resource development efforts, and I find this collaboration very encouraging.”
The partnership between RPI and Hokkaido University comes at a critical time for semiconductor manufacturing in the United States and Japan.
Located in the heart of the nation’s semiconductor research and manufacturing epicenter, RPI has long been a leader in chip innovation. In Hokkaido, Japan’s northernmost island, Rapidus is building a state-of-the-art semiconductor manufacturing facility. Rapidus and Hokkaido University recently formed a partnership on semiconductor education and research, and Rapidus and IBM also announced a partnership.
“One of the three pillars of our founding is the development and advancement of human resource capabilities,” said Dr. Atsuyoshi Koike, CEO of Rapidus Inc. “Close international collaboration through academia and industry is crucial as we collaborate on the global workforce needed to develop and manufacture cutting-edge semiconductors. We congratulate RPI and Hokkaido University on achieving this latest milestone, another important step in accelerating our human resource advancements.”
On the same day, a Japanese delegation visited the Albany Nanotechnology Center, where NY CREATES, Empire State Development and Governor Suzuki endorsed a partnership to support the global semiconductor industry.
