The solution identifies subtle defects such as loose wires, shorts and stray wires to provide a comprehensive assessment of wire bond integrity.
Advanced capacitance-based test methodology provides superior defect detection
The test platform is high volume production capable and can test 20 integrated circuits simultaneously for a throughput of up to 72,000 units per hour.
SANTA ROSA, Calif., Aug. 28, 2024 –(BUSINESS WIRE)–Keysight Technologies, Inc. (NYSE: KEYS) introduces the Electrical Structure Tester (EST), a wirebond inspection solution for semiconductor manufacturing that ensures the integrity and reliability of electronic components.
The semiconductor industry faces testing challenges due to increasing chip densities in mission-critical applications such as medical devices and automotive systems. Current test methods often fail to detect structural defects in wire bonds, leading to increased costs due to latent failures. Additionally, traditional test techniques often rely on sampling techniques that do not adequately identify structural defects in wire bonds.
EST addresses these testing challenges by using cutting-edge nano-vectorless test enhanced performance (nVTEP) technology to create a capacitive structure between the wire bond and the sensor plate. Using this method, EST can identify subtle defects such as slack wires, near shorts and stray wires to comprehensively assess the integrity of the wire bonds.
The main advantages of EST are:
Advanced Defect Detection – Identifies a wide range of wirebond defects, both electrical and non-electrical, by analyzing changes in capacitive coupling patterns to ensure functionality and reliability of electronic components.
High-Volume Manufacturing Support – Up to 20 integrated circuits can be tested simultaneously, providing throughput of up to 72,000 units per hour, improving productivity and efficiency in high-volume manufacturing environments.
Integrate big data analytics – Capture defects and improve yield through advanced methods such as Marginal Retry Test (MaRT), Dynamic Part Averaging Test (DPAT) and Real-Time Part Averaging Test (RPAT).
“Keysight is committed to pioneering innovative solutions that address the most pressing challenges in the wire bonding process,” said Carol Leh, vice president, Center of Excellence, Electronic Industry Solutions Group, Keysight. “Our electrical structure testers enable chip manufacturers to quickly identify wire bond defects to improve production efficiency and ensure superior quality and reliability in high-volume production.”
The story continues
The electrical structural tester will be on display at Keysight’s booth (K3283) at SEMICON Taiwan 2024, which takes place from September 4 to 6, 2024, at the Taipei Nangang Exhibition Center Hall 1.
resource
About Keysight Technologies
Keysight (NYSE: KEYS) inspires innovators and helps deliver world-changing technology. An S&P 500 company, we provide market-leading design, emulation and test solutions to help engineers develop and deploy products faster and with less risk throughout their entire product lifecycle. We are a global innovation partner helping customers in the communications, industrial automation, aerospace and defense, automotive, semiconductor and general electronics markets accelerate innovation to connect and secure the world. For more information, visit the Keysight Newsroom and www.keysight.com.
View source version on businesswire.com: https://www.businesswire.com/news/home/20240828637480/en/
contact address
Keysight Media Contact
North American Public Relations Team
pdl-americas-keysight-pr@keysight.com
Fusako Doi
Asia
+81 42 660-2162
fusako_dohi@keysight.com
Jenny Gallacher
Europe
+44 (0) 7800 737 982
email address
