Hod Hasharon, Israel, March 10, 2025 /PRNewswire/ – Valens Semiconductor (NYSE:VLN), a leader in high performance connectivity, today announced that it will be displaying the innovative connectivity technologies needed for a variety of AI applications in Embedded World 2025. These companies include Leopard Imaging, Acroname, Airy3D, Cherry Embedded Solutions, D3 Embedded, Fabrimex, Framos, Intel, RGO Robotics, and Teledyne E2V.
Two innovative connection standards, the MIPI A-PHY and the HDBASET USB3, will be taken to the center stage at the Valens booth. MIPI A-PHY provides native extensions to the widely used CSI-2 interface, providing robot developers with the ability to separate from processing sensors that provide unprecedented design flexibility, cost-effectiveness, and performance. HDBASET USB3 offers USB 3.2 extensions, allowing major camera vendors to expand their USB 3.2 product line for applications that require longer link distances.
The demonstrations at Valens booth include:
NVIDIA’s ultimate connectivity infrastructure – AI platforms including AMR, robotic arms and more.
EMC Technology Shootout – Valens chipset withstands 20x the noise with live brand EMC shootouts against competing legacy solutions.
Simplest Wiring Infrastructure – Native CSI-2 expansion based on the MIPI A-PHY standard allows for fast, long-term sensor connections with the most challenging connectors and cables.
Solving USB Challenge for Embedded Systems – Extending and Test Automating the USB 3 Protocol.
Valens has two opportunities to talk about at the show:
How can Connectivity Innovations change the industrial market?
March 11th, 11:00-11:30am cet
Session 1.1 Addressing challenges in the IoT and Connectivity Medical Industry’s transition to disposable endoscopes
March 11th3:00 – 3:30 PM CET Session 6.1 Embedded Vision
“Valens’ entry into machine vision is already shaking the market, with two standards-compliant chipsets offering transformative connectivity,” he said. Moti StrobachValens Semiconductor’s VP business development. “Our chipsets extend two of the industry’s most commonly used interfaces, enabling our customers and partners to reach new and exciting applications. We are proud to showcase our technology with the 2025 embedded.
date: March 11th-13th
Booth: Hall 2, 454
Schedule a demo tour with experts and discover Valens’ high-performance sensor connections.
About Valens Semiconductors
Valens Semiconductor (NYSE: VLN) is a leader in high performance connectivity, enabling customers to change the digital experiences of people around the world. Valens’ chipsets are integrated into countless devices from major customers, enabling the power of cutting-edge audio-video installations, next-generation video conferencing, and evolution of ADA and autonomous driving. Pushing up the boundaries of connectivity, Valens sets standards everywhere it operates, and its technology forms the basis for key industry standards such as HDBASET® and MIPI A-PHY. For more information, please visit https://www.valens.com/.
Forward-looking statements
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Press Contact
Yoni Dayan
Communications Manager
Valens Semiconductor Ltd.
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Investor contact information
Mikal Ben Ali
Investor Relations Manager
Valens Semiconductor Ltd.
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