Demand for Nvidia’s cutting-edge Blackwell dual-die design is reportedly outpacing Nvidia’s lower-end single-die design. The multi-trillion dollar GPU manufacturing giant plans to change its Blackwell architecture roadmap to prioritize dual-die designs with CoWoS-L packages, reports TF International Securities analyst Ming-Chi Kuo (Medium). It is said that it has been updated.
Starting in the first quarter of this year, Nvidia will reportedly focus on 200 series Blackwell GPUs. However, it is important to note that this only includes multi-die versions of the 200 series, such as the GB200 NVL72. Single die versions of the 200 series, such as the B200A, have been discontinued.
Similarly, it appears Nvidia plans to prioritize B300 series models that utilize multiple dies, especially the GB300 NVL72. B300 GPU variants that use only a single die are given lower priority in manufacturing due to high demand for multi-die variants. Nvidia’s higher-priority Blackwell GPU models use TSMC’s more advanced CoWoS-L technology. Both the discontinued B200A and single-die B300 GPUs use CoWoS-S.
These changes will hit certain suppliers “particularly hard” as Nvidia prioritizes dual-die designs. Therefore, CoWoS-L packaging is required to build these models. Companies that supply CoWoS-S to Nvidia will be most impacted by Nvidia’s new roadmap.
However, TSMC is not expected to be significantly affected by these changes. The Taiwanese semiconductor maker plans to prioritize CoWoS-L as its mainstream solution, which is in line with Nvidia’s plans to use CoWoS-L as its primary solution. Additionally, the transition from B200 to B300 manufacturing involves the same FEoL process, increasing production efficiency and reducing potential downtime. TSMC expects AI/HPC to be a major source of growth in 2025.
CoWoS-S and CoWoS-L are packaging technologies developed by TSMC. CoWoS-S (Chip-on-Wafer-on-Substrate with Silicon Interposer) provides high-density interconnects and deep trench capacitors in a large silicon interposer area to accommodate components such as logic chipsets and HBM memory. Provide.
CoWoS-L combines CoWoS-S and InFO (Integrate Fan-Out technology) to increase flexibility in using LSI or local silicon interconnect chips and interposers for die-to-die interconnects. These bridges are a critical part of the design and are the reason multichip Blackwell GPUs are able to sustain 10TB/s NVLink interconnects.
