Monday, January 6, 2025, 10 a.m.
By the Semiconductor Industry Association
WASHINGTON—January 6, 2025—The Semiconductor Industry Association (SIA) today issued the following statement from SIA President and CEO John Neufer, announcing the lauded the announcement of a new CHIPS for America research and development (R&D) facility that will deliver innovative packaging. The facility’s prototyping research will be operated by the National Semiconductor Technology Center (NSTC) and its advanced packaging research will be operated by the National Advanced Packaging Manufacturing Program (NAPMP).
“Today’s announcement is a welcome step forward for America’s leadership in semiconductor innovation and represents significant progress in implementing the important research and development programs established in the bipartisan CHIPS and Science Act.” The new facility will benefit from and build on the state’s already strong semiconductor manufacturing and advanced packaging ecosystem.
“For America to remain the world’s technology leader, we must continue to lead in semiconductor innovation. Promoting U.S. research in chip prototyping and advanced packaging will lead the U.S. to chip technology. We continue to work with leaders in Washington to ensure that CHIPS and science law research and development initiatives and manufacturing incentives are on track to improve America’s economic strength and national security. We look forward to bringing significant benefits to global competitiveness.”
The NSTC Prototyping and NAPMP Advanced Packaging Test Facility combines state-of-the-art manufacturing and packaging and next-generation technology development to provide NSTC members and NAPMP-funded researchers with 300mm research, prototyping, and Provides packaging functionality. Coexistence of NSTC’s R&D prototyping capabilities and NAPMP packaging capabilities in one facility provides unique value to the domestic semiconductor ecosystem for jointly conducting semiconductor and advanced packaging research .
Late last year, NatCast and the Department of Commerce announced two other CHIPS for America research and development sites: the NSTC EUV Center and the NSTC Management Design Facility.
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About SIA
The Semiconductor Industry Association (SIA) is the voice of the semiconductor industry, one of America’s top export industries and a critical driver of America’s economic strength, national security, and global competitiveness. SIA accounts for 99% of the U.S. semiconductor industry by revenue and almost two-thirds of non-U.S. semiconductor companies. Through this collaboration, SIA works with Congress, governments, and key industry stakeholders around the world to promote semiconductor manufacturing, promote policies that foster innovation, advance business, and foster global competition. We aim to strengthen design and research leadership. For more information, please visit www.semiconductors.org.