Semiconductor company Infineon (Ifny) announced this week a new silicon power wafer that it says is the “world’s thinnest.” The new silicon wafer developed for AI data centers can reduce power losses by more than 15%, including for high-end AI server applications, the company said.
Infineon says the silicon wafer is 20 micrometers thick and 300 millimeters in diameter, which is equivalent to a quarter of the thickness of a human hair. Silicon wafers are half the thickness of today’s advanced wafers.
“The new ultra-thin wafer technology will power various AI server configurations from the grid to the core in the most energy efficient way,” Adam White, who oversees power and sensor systems at Infineon, said in a statement. It furthers our goals.” “Energy efficiency is becoming increasingly important as the energy demands of AI data centers increase significantly. For Infineon, this is a fast-growing business opportunity. With mid-double-digit growth rates, our AI We expect the business to reach €1 billion within the next two years.”
