Valens marks its first global penetration by integrating the recently launched Valens chipset into cutting-edge machine vision products from companies such as Teledyne e2v, Airy3D, FRAMOS, D3 Embedded, and Leopard Imaging . $460 million Entire addressable market
Hod Hasharon Israel, October 1, 2024 /PRNewswire/ — Today, Valens Semiconductor (NYSE: VLN), a leader in high-performance connectivity, launches an innovative chipset with outstanding EMC performance and native CSI-2 enhancements for the industrial machine vision market. announced that it would be exhibited. Support for MIPI A-PHY compliant VA7000 and USB 3.2 extensions for VS6320.
Based on various market studies, the Machine Vision market is expected to reach the following sizes: $7.8 billion This goal is expected to be achieved by 2029 through increased automation in factories and warehouses and stricter inspection regulations. MIPI A-PHY is well-suited for this market because it allows the technology to be integrated within the sensor, resulting in smaller, more powerful, and less expensive cameras. Valens expects this segment’s Total Addressable Market (TAM) to reach the following levels: $460 million By 2029.
“Machine vision is on the rise in many industries, and Valens is well-positioned to capture significant market share with two of our most innovative chips, the VA7000 and VS6320,” he said. gabi shurikisenior vice president and head of audio-video business at Valens Semiconductor. “We look forward to expanding our partnerships in this industry to enable our chipsets to enable advanced machine vision solutions.”
Both the VS6320 and VA7000 offer great value for vision applications in the industrial market. The VA7000 chipset was originally designed for automotive use and was the first to comply with the MIPI A-PHY standard for high-performance sensor connectivity. A-PHY’s unique design provides automotive-grade, high-performance connectivity, allowing customers to reduce camera power, size, and cost. All of these are essential for machine vision applications. VS6320 is the first one ASICBased USB 3.2 high-performance expansion solutions are now available on the market. The VS6320 chipset eliminates the main limitation of USB-based industrial cameras, the short link distance, while retaining all the benefits.
Valens partners with leading camera module manufacturers for industrial machine vision, and its chipsets power state-of-the-art products from companies such as Teledyne e2v, Airy3D, FRAMOS, D3 Embedded, and Leopard Imaging.
Teledyne e2v supports MIPI A-PHY for the Optimom™ series of turnkey imaging modules. This option paves the way for use in certain MIPI applications where the vision processing unit is located some distance from the module.
“Our Optimom modules are widely used in multiple industries, and our latest Optimom™ 5D is a breakthrough solution that provides both 2D and 3D vision simultaneously,” said François Trolez, Marketing Manager at Teledyne e2v. states. “Valens offers state-of-the-art long-range MIPI connectivity using simple, unshielded cables. We included A-PHY as an option because of its perfect EMC performance and recognition as an industry standard. This is why we included A-PHY as an option to ensure reliability of vision data and provide an exciting proposition for our robotics and AMR-focused customers.”
The new Optimom 5D module features Teledyne e2v’s Topaz5D™ image sensor and provides both 2D vision and 3D depth data output. This unique 5D technology is powered by Airy3D IP and software.
“Airy3D’s DepthIQ single-sensor IP enables machine vision applications that traditional short-range stereo and time-of-flight products cannot address,” he said. Ron LoweSenior Vice President of Business Development and Marketing. “By partnering with both Teledyne e2v and Valens Semiconductor, our combined solutions will enable us to overcome challenges such as occlusion, changing light conditions, and long reach delays, making this an exciting future for the machine vision industry. This is an exciting development.”
FRAMOS, the world’s leading expert in embedded vision systems, adds support for A-PHY sensor modules to its popular FSM and FSM:GO ecosystem of optical image sensor modules, offering high bandwidth, link distance, and cable flexibility. We realized this.
“At FRAMOS, we pride ourselves on providing our customers with the most advanced technology on the market, giving them the best possible image in their memory of their solutions,” said Andre Brera, Product Manager at FRAMOS. I am. “Due to the market demand for standardized long-range CSI-2 extensions and the innovations enabled, we are pleased to offer Valens an adapter module option with the VA7000 A-PHY chipset available to our mutual customers. This technology includes features such as cable length, EMC performance, and advanced link diagnostics.
D3 Embedded, which specializes in embedded AI imaging solutions, integrates the VA7000 chipset into its camera modules, enabling longer link distances and the use of simple, flexible cables.
“We are impressed with Valens’ ability to deliver multi-giga link speeds over unshielded cables and connectors.” Scott ReardonCEO of D3 Embedded. “This is what our customers in the industrial vehicle and robotics markets have been asking for and opens the door to more optimized embedded vision solutions. We are pleased to bring this product to our customers.”
Leopard Imaging, a long-established supplier of high-performance machine vision cameras, offers A-PHY camera modules tailored for industrial applications.
“We are well aware of the technical advantages that Valens’ A-PHY chipset brings through our automotive module products.” cliff chenSenior Vice President of Marketing, Leopard Imaging. “The A-PHY solves our problem by providing high-bandwidth, long-distance connectivity and ensures robust EMC immunity. These camera modules power our innovative cross-market solution. I’m looking forward to it.”
Valens’ VA7000-based solution with Teledyne e2v, Airy3D, FRAMOS, D3 Embedded, Leopard Imagingsimilar to Valens VS6320. It will be exhibited at VISION’s Valens booth (10F80). stuttgartabove October 8-10, 2024.
About Valens Semiconductor
Valens Semiconductor (NYSE:VLN) is a leader in high-performance connectivity that enables customers to transform digital experiences for people around the world. Valens chipsets are integrated into countless devices from leading customers, powering cutting-edge audio-video equipment, next-generation video conferencing, and enabling the evolution of ADAS and autonomous driving. Pushing the boundaries of connectivity, Valens is setting standards everywhere it operates, and its technology forms the basis of leading industry standards such as HDBaseT® and MIPI A-PHY. For more information, please visit https://www.valens.com/.
Forward-looking statements
This press release contains “forward-looking statements” within the meaning of the “safe harbor” provisions of the Private Securities Litigation Reform Act of 1995. Forward-looking statements may be identified by the use of terms such as “estimates,” “estimates,” “estimates” and similar terms. “plan,” “project,” “anticipate,” “intend,” “plan,” “anticipate,” “anticipate,” “believe,” “seek,” “target,” or and other similar expressions that predict or indicate future events. Items that are not statements about trends or historical matters. These forward-looking statements include, but are not limited to, statements regarding expected future results, such as financial results, exchange rates, contract awards, and future economic and market conditions. These statements are based on various assumptions and current expectations of Valens Semiconductor (“Valens”) management, whether or not identified in this press release, and are not predictive of actual performance. . These forward-looking statements are provided for illustrative purposes only and are not intended to be a guarantee, guarantee, prediction, or to serve as a definitive statement of fact or probability, and are not intended to serve as a guarantee, guarantee, prediction, or conclusive statement of fact or probability. Don’t trust it. Actual events and circumstances are difficult or impossible to predict and may differ from assumptions. Many actual events and circumstances are beyond the control of Valens Semiconductor. These forward-looking statements are subject to a number of risks and uncertainties, including business cycles in the semiconductor industry. the impact of the inflation and rising interest rate environment on our customers and industry; Customer inventory absorption capacity. the impact of the global coronavirus pandemic on our customers’ budgets and general financial conditions, and the length, severity and pace of post-pandemic recovery; competition in the semiconductor industry and our failure to timely introduce new technologies and products to successfully compete with our competitors; If Valens is unable to adjust supply chain volumes due to changes in market conditions or is unable to estimate customer demand. disruption of Valens’ relationships with key customers; It will be difficult for Valens to sell its products if customers do not incorporate its products into their own products. Valens relies on the winner selection process. Even if Valens is successful in the selection process for its products, Valens may not be able to generate timely or sufficient net sales or margins from those selections. continued yield issues or other delays in the manufacturing process of our products; our ability to effectively manage, invest in, grow and retain our sales force, research and development capabilities, marketing team and other key personnel; our ability to adjust product prices to our customers in a timely manner as prices increase through our supply chain; Ability to adjust inventory levels due to reduced demand due to customer inventory buffers. our expectations regarding the outcome of future litigation in which we are named as a party; our ability to adequately protect and defend our intellectual property and other proprietary rights; The market price and trading volume of Valens common stock may fluctuate and may decline significantly. political, economic, governmental and tax implications related to our establishment and location; Israel; and the factors discussed in Valens’ Form 20-F filed with the SEC. February 28, 2024 Other documents of Valens filed or to be filed with the SEC under the heading “Risk Factors.” If any of these risks materialize or our assumptions prove incorrect, actual results could differ materially from those suggested by these forward-looking statements. There may be additional risks that Valens is not currently aware of or that Valens currently believes to be immaterial, which could cause actual results to differ from those contained in the forward-looking statements. There is also gender. Additionally, forward-looking statements reflect Valens’ expectations, plans and projections regarding future events and beliefs as of the date of this press release. Mr. Valens expects that subsequent events and developments may change his evaluation. However, while Valens may elect to update these forward-looking statements at some point in the future, Valens specifically disclaims any obligation to do so. These forward-looking statements should not be relied upon as representing Valens’ evaluation as of any date subsequent to the date of this press release. Therefore, you should not place undue reliance on forward-looking statements.
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Valens Semiconductor Co., Ltd.
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